Sprungmarken

Servicenavigation

Hauptnavigation

Sie sind hier:

Hauptinhalt

Laborausstattung

  • Clean room
    • Class 100 (on workbenches)
    • Class 10000 (in the walking area)

  • Photolithography
    • Süss MA 56 Mask Aligner (Substrates up to 100mm diameter)
    • Süss MA 6 Mask Aligner (AG MST, Substrate up to 150 mm diameter, back side alignment)
    • Süss MJB 3 Mask Aligner (Substrates up to 75 mm diameter)

  • Deposition
    • Balzers BAK 604 Sputter System (up to 30 100 mm substrates)
    • Leybold L 400 Sputter System (3" diameter)
    • Pfeiffer PLS 500 Evaporation System
    • Plasma Technology PECVD-System 100 for SiO2 / SiON, Si3N4, SiOC and SiC (installed April 2002, System is optimised for thick optical layers up to 30 µm with high rate, Maximum substrate size: 150 mm)
    • Electroplating for copper

  • Etching
    • 2 Plasma Technology RIE System DP 80
      (F-based processes only)
    • KOH / AHW wet anisotropic etching
      (optimised for homogenous etching with ultrasonic support)
    • Baltec CPD 404 Critical Point Dryer for 100 mm wafers

  • Tube Furncaces
    • SVG Thermco 3-zone furnace 1.100 °C
    • GERO vacuum-tube furnace 1.300 °C
      (both furnaces for wafer annealing / oxidation up to 100 mm only)

  • Ion Exchange
    • Ion exchange furnaces for thermal and field-supported ion exchange in glass (currently under development, up to 100 mm diameter)

  • Dicing Saw
    • ESEC 8004 Dicing Saw (up to 6")

  • REM
    • JEOL JSM-6400 with
    • ELPHY Quantum(Raith GmbH)
    • Universal SEM Based Nano Lithography System

  • Precision Measurement
    • Tencor Alphastep 200 (Step heigth measurement)
    • Leica MPV-CD2 (Line width measurement)
    • Sentech CER 500 Ellipsometer / Reflectometer with scanning table
      (automated wafer mapping for layers from 0 to 30 ?m; wavelengths 633 nm and 1550 nm)
    • optical characterisation equipment for passive waveguides and components at 633 nm, 1300 nm and around 1550 nm (tunable laser)

  • Bonding
    • WESTBOND 7400 A Manual Bonder

  • Polishing

    • High Frequency Measurement Equipment
      • Wiltron 360B Network Analyzer (vectorial)
        with active device tester (40 MHz - 40 GHz)
      • HP 8593E Spectrum Analyzer
        (9 kHz - 26.5 GHz)
      • Tektronix Sampling Scope
        (up to 12 GHz, rise time 350 ps)
      • Agilent E4419B dual power meter
        with two E9301A 10 MHz - 6 GHz average power sensors

    • High Power Microwave Generators
      • SAIREM Magnetron generator
        (2.45 GHz, 1.2 kW)
      • Agilent E8257D signal generator
        (20GHz, AM/FM/PM option)

    • Optical Transmission Systems
      • 11 x 10 GBit WDM system (including EDFAs, DCFs and 500 km of SSMF; current configuration: 6 x 80 km spans with optical dispersion compensation)
      • 8x Thorlabs Pro 8000 Distributed Feedback Laser (DFB) WDM Source
      • Agilent 81940 A Tunable Laser Source
      • HP 8168B Tunable Laser Source
      • HP 8168C Tunable Laser Source
      • HP 8168F Tunable Laser Source
      • HP 11896A Polarization Controller
      • HP 8153A Lightwave Multimeter (2x)
      • Agilent 8163B Lightwave Multimeter
      • Agilent E82570 PSG Analog Signal Generator (250 kHz - 20 GHz)
      • Agilent 54622A Oscilloscope
      • Agilent Infiniium DCA-J 86100C Oscilloscope (Digital Communications Analyzer)
      • HP 7004A Optical Spectrum Analyzer
      • Advantest Q8384 Optical Spectrum Analyzer
      • Anritsu MP 1800A Signal Quality Analyzer (Bit Error Ratio Tester)
      • EG&G Boxcar Averager (Model 162)
      • HP EFA2000 (EDFA)
      • Anritsu Optical Time Domain Reflectometer MW920 A
      • Fujikura 40F Fiber Splicing Device
      • Advantest TQ-8346 High Resolution Optical Spectrum Analyzer
      • Tektronix AWG7122B Arbitrary Waveform Generator (2x12 GS/s)
      • Tektronix DPO72004 Digital Phosphor Oscilloscope (50 GS/s)

    RR1

    RR2

    RR3

    RR4